MOLDING COMPOUNDS DSV-2, DSV-4

Molding compounds DSV -2 and DSV-4 are manufactured of glass strands impregnated with phenol-formaldehyde binder.

Advantages: high mechanical properties, good heat resistance, easy flowing and dosing provide wide utilization of these materials.

Application:   DSV materials are widely used in radio engineering, electrical engineering, aircraft industry, machine building, instrument making industry and also in chemical industry and radio electronics.

High strength details produced of these molding compounds are suitable for operation at temperatures   from  -196 ?C to + 200?C and in conditions of tropical climate.

Properties	DSV-2 (natural color)			DSV-4 (natural color)
	L	O	P	L	O	P
Nominal length of granules, mm	6	10	18 or 20	6	10	18 or 20
Flexural stress at break, mPa, not less than	157	236	296	137	196	265
Breaking stress at compression, mPa,not less than	127	127	127	127	127	127
Impact strength, kJ/m2 , not less than	44	69	79	34	69	88
Tangent of the loss angle at fr, 106 Hz,not more than	0.035	0.035	0.035	0.035	0.035	0.035
Dielectric constant at frequency 106 Hz, not more than	7	7	7	7	7	7
Volume resistivity, Ohm · m, not less than	10 10	10 10	10 10	10 10	10 10	10 10
Surface resistivity, Ohm, not less than	10 12	10 12	10 12	10 12	10 12	10 12
Dielectric strength at frequency 50Hz, kV/mm, not more than	14	14	14	14	14	14
Binder content, %	38 ± 2	38 ± 2	38 ± 2	38 ± 2	38 ± 2	38 ± 2
Moisture and volatiles content, %	1,5 ÷ 3	1,5 ÷ 3	1,5 ÷ 3	1,5 ÷ 3	1,5 ÷ 3	1,5 ÷ 3
Flowability, s	4 ÷12	4 ÷12	4 ÷12	4 ÷12	4 ÷12	4 ÷12
Fire resistance (category)	PV-O	PV-O	PV-O	PV-O	PV-O	PV-O
Coefficient of smoke generation -at smoldering -at burning	21-39 61-81	21-39 61-81	21-39 61-81	21-39 61-81	21-39 61-81	21-39 61-81

Packaging

These materials are packed into 15 kg multiwall paper bags with polyethylene inserts.

Guaranteed shelf life: - 6 months since the date of its production.