MOLDING COMPOUND AG-4V-10-4,5
( TU U 24.1-05758977.005-200 4 )
Molding compound AG-4V-10-4,5 is manufactured on the base of modified phenol-formaldehyde binder and glass fiber as a filler.
It is designed for manufacturing (by compression and transfer molding) articles of engineering and electro-technical application suitable for exploitation at temperature ranges from -196 °C to +200°C and in conditions of tropical climate.
Appearance: granules of irregular form with length 2 - 10 mm and cross section 5 - 10 mm.
Size of granules may be changed according to customer’s request.
This material can be used instead such molding compounds as AG-4V, AG-4V-10 (GOST 20437-89) and molding compounds GSP, DSV (GOST 17478-95)
Processing parameters:
- Specific pressure, MPa - 19,6 ÷ 34,4
- Temperature, ºÑ - 145,5±5
- Time, min - 9-11
| Properties |
TU U 24.1-05758977.005-2004 |
|---|---|
|
Mass part of binder, % |
42 - 50 |
|
Mass part of moisture, %, not more |
1,5 – 5,0 |
|
Flexural stress at break, mPa, not less than |
50 |
|
Breaking stress at compression, mPa, not less than |
80 |
|
Impact strength, kJ/m2, not less than |
5 |
|
Dielectric strength at frequency 50Hz, mV/m( kV/mm), not less than |
14,0 |
|
Volume resistivity, Ohm·m (Ohm·cm), not less than |
1010 (1012 ) |
|
Surface resistivity, Ohm, not less than |
10 10 |
|
Tangent of the loss angle at frequency 106 Hz, not more than |
0,04 |
|
Dielectric constant at frequency 106 Hz, not more than |
7,0 |
|
Tests are carried out in accordance with methods of GOST 20437-89 |
|